Broadcom’s third-generation co-packaged optics (CPO) technology is engineered to address the scale issues in optical ...

The LSM6DSV320X IMU from ST features dual accelerometers for activity tracking up to 16 g and impact detection up to 320 g.

Sycamore-W, an ultra-thin near-field MEMS speaker from xMEMS, brings premium audio to smartwatches and fitness bands.

Qorvo has expanded its QPG6200 portfolio of low-power wireless SoCs supporting Matter over Thread, Zigbee, and Bluetooth LE.

While implementing a capacitor auto‐discharge module is easy, engineers must choose the right bleeder resistor and discharge ...

Infineon’s 650-V G5 bidirectional switch integrates two switches in a single device to actively block current and voltage in ...

The VNA and VVM options for the Site Master MS2085A and MS2089A portable analyzers are now available, with existing ...

This author's first encounter with LEDs happened in 1967 after attending the bustling NEREM conference in Boston.

Where do MRAM and ReRAM technologies stand after years of promise to replace incumbent memories? Gary Hilson speaks to MRAM ...

Questa One pushes the IC verification boundaries with AI capabilities and faster functional, fault, and formal engines.

Hardware and software solutions are starting to emerge for this protocol stack promising a new era of location awareness.

Add-on features are all the rage in electronic products. But are they actually handy or just embody bells and whistles?